DocumentCode
2682324
Title
Processing technology of embedded thin-film resistor materials
Author
Lai, Lifei ; Sun, Rong ; Zhao, Tao ; Zeng, XiaoLiang ; Yu, ShuHui
fYear
2011
fDate
25-28 Oct. 2011
Firstpage
60
Lastpage
65
Abstract
It is relatively rare for us to research Embedded Thin-Film Resistor (ETFR) Materials in domestic. This paper describes the development history and present situation of the ETFR, the whole process technology is told, the urgency of domestic products is revealed, the thermal stability and microscopic characteristics of the Ni-Cr (80/20 wt.%) ETFR material that we have researched are introduced, the possible development and application is also tentatively discussed.
Keywords
chromium; nickel; thermal stability; thin film resistors; ETFR material; Ni-Cr; embedded thin-film resistor material; microscopic characteristic; processing technology; thermal stability; Films; Metals; Resistance; Resistors; Sputtering; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials (APM), 2011 International Symposium on
Conference_Location
Xiamen
ISSN
1550-5723
Print_ISBN
978-1-4673-0148-0
Type
conf
DOI
10.1109/ISAPM.2011.6105671
Filename
6105671
Link To Document