Progress on thermally conductive adhesive for electronic packaging

With the development of miniaturization of electrical and electronic components, the dissipation of heat has become urgent issue. TCAs play an important role in bonding and packaging of electronic devices and resolve the problem of heat dissipation. Currently, the research on TCAs involves preparation of filler, modification of filler surface, filling model and the influence of interface between filler and matrix resin on heat conductivity and other properties of TCAs. Many researchers have made contribution to the theory model and mechanism of TCAs, but there is no a theory or model that can be suitable for all types of fillers. So it´s a long way to go for the development of TCAs, and we believe that TCAs will bring revolutionary change for the electrical and electronic developments.