• DocumentCode
    2683656
  • Title

    Design of resonators for the determination of the temperature coefficients of elastic constants of monocrystalline silicon

  • Author

    Bourgeois, C. ; Steinsland, E. ; Blanc, N. ; de Rooij, N.F.

  • Author_Institution
    CSEM, Neuchatel, Switzerland
  • fYear
    1997
  • fDate
    28-30 May 1997
  • Firstpage
    791
  • Lastpage
    799
  • Abstract
    More accurate sets of the first and second order temperature coefficients are presented for monocrystalline silicon of a low-doped p-type silicon and high-doped n-type silicon. These values are extrapolated from the frequency-temperature curve of high-Q silicon resonators. Three types of resonators have been designed and fabricated using silicon bulk micromachining, each with a mode of vibration depending as close as possible on one of the three independent elastic constants. The electromechanical coupling and the related equivalent circuit of an electrostatic drive have been established for two of these modes. The temperature coefficients of the three independent elastic constants, as well as their estimated variances are computed through the fitting of the measured frequency-temperature curves, compared with the sensitivity of each mode to the elastic constants determined by simulations
  • Keywords
    elastic constants; elastic moduli measurement; elemental semiconductors; equivalent circuits; mechanical variables measurement; micromachining; micromechanical resonators; silicon; Si; bulk micromachining; elastic constant; electromechanical coupling; electrostatic drive; equivalent circuit; high-doped n-type silicon; low-doped p-type silicon; monocrystalline silicon; resonator; temperature coefficient; vibration mode; Computational modeling; Coupling circuits; Curve fitting; Electrostatic measurements; Equivalent circuits; Frequency estimation; Frequency measurement; Micromachining; Silicon; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frequency Control Symposium, 1997., Proceedings of the 1997 IEEE International
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7803-3728-X
  • Type

    conf

  • DOI
    10.1109/FREQ.1997.639192
  • Filename
    639192