DocumentCode
2683883
Title
Pyroelectric properties of the PTCa/PEKK composite transducers
Author
Marin-Franch, P. ; Tunnicliffe, D.L. ; Das-Gupta, D.K.
Author_Institution
Univ. of North Wales, Bangor, UK
fYear
2000
fDate
2000
Firstpage
386
Lastpage
391
Abstract
Ferroelectric thin films of ceramic/polymer composite sensors with mixed connectivities possess high values of piezo- and pyroelectric coefficients and the formability and flexibility which are not attainable in a single-phase ferroelectric material, an electroceramic or a polymer. The present paper reports a study of the pyro-, piezoelectric and dielectric properties of the ceramic/polymer composite films composed of the calcium modified lead titanate (PTCa) ceramic and the non-polar thermoplastic polymer, polyetherketoneketone (PEKK). The pyroelectric coefficient has been measured both by a direct method and the thermal step technique. Dielectric spectroscopy measurements were carried out in the frequency range of 10-5 Hz to 106 Hz at room temperature. Additionally, the magnitude of the piezoelectric coefficient d33 and an estimation of the kt coefficient are also reported. Furthermore, Scanning Electron Microscope (SEM) pictures are included in order to show the inner structure, mixed connectivity of the ceramic/polymer reported
Keywords
calcium; composite materials; ferroelectric thin films; lead compounds; piezoceramics; piezoelectric thin films; piezoelectric transducers; polymer films; pyroelectricity; scanning electron microscopy; PTCa/PEKK composite transducers; PbTiO3:Ca; SEM; calcium modified lead titanate; ceramic/polymer composite sensors; direct method; ferroelectric thin films; flexibility; formability; mixed connectivities; piezoelectric coefficient; piezoelectric coefficients; polyetherketoneketone; pyroelectric coefficient; pyroelectric coefficients; pyroelectric properties; thermal step technique;
fLanguage
English
Publisher
iet
Conference_Titel
Dielectric Materials, Measurements and Applications, 2000. Eighth International Conference on (IEE Conf. Publ. No. 473)
Conference_Location
Edinburgh
Print_ISBN
0-85296-730-6
Type
conf
DOI
10.1049/cp:20000538
Filename
888147
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