DocumentCode
2683900
Title
Effect of different latent curing agents on the performance of isotropy conductive adhesives and its application in LED
Author
Wang, Ling ; Wang, Hongqin ; Wan, Chao ; Wang, Pengcheng ; Li, Mingyu ; Du, Bin ; Deng, Meiling ; He, Lijiao
Author_Institution
State Key Lab. of Adv. Welding Production Technol., Harbin Inst. of Technol., Shenzhen, China
fYear
2011
fDate
25-28 Oct. 2011
Firstpage
446
Lastpage
449
Abstract
The effect of three kind latent curing agents (methylhexahydrophthalic anhydride, dicyandiamide and phenolic resin) on the performance of isotropy conductive adhesives were investigated. The thermal stability, lap shear strength, volume resistivity of ECAs were tested and the reliabillity of its application in LED was also evaluated. It was found that the ECA with MeHHPA as hardner showed the best combination performance.
Keywords
conductive adhesives; curing; light emitting diodes; resins; shear strength; thermal conductivity; thermal stability; LED application; dicyandiamide resin; isotropy conductive adhesive; lap shear strength; latent curing agent; methylhexahydrophthalic anhydride; phenolic resin; thermal stability; volume resistivity; Conductive adhesives; Conductivity; Curing; Light emitting diodes; Materials; Packaging; Thermal stability; LED application; curing agent; isotropy conductive adhesives; reliabillity;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials (APM), 2011 International Symposium on
Conference_Location
Xiamen
ISSN
1550-5723
Print_ISBN
978-1-4673-0148-0
Type
conf
DOI
10.1109/ISAPM.2011.6105750
Filename
6105750
Link To Document