• DocumentCode
    2683900
  • Title

    Effect of different latent curing agents on the performance of isotropy conductive adhesives and its application in LED

  • Author

    Wang, Ling ; Wang, Hongqin ; Wan, Chao ; Wang, Pengcheng ; Li, Mingyu ; Du, Bin ; Deng, Meiling ; He, Lijiao

  • Author_Institution
    State Key Lab. of Adv. Welding Production Technol., Harbin Inst. of Technol., Shenzhen, China
  • fYear
    2011
  • fDate
    25-28 Oct. 2011
  • Firstpage
    446
  • Lastpage
    449
  • Abstract
    The effect of three kind latent curing agents (methylhexahydrophthalic anhydride, dicyandiamide and phenolic resin) on the performance of isotropy conductive adhesives were investigated. The thermal stability, lap shear strength, volume resistivity of ECAs were tested and the reliabillity of its application in LED was also evaluated. It was found that the ECA with MeHHPA as hardner showed the best combination performance.
  • Keywords
    conductive adhesives; curing; light emitting diodes; resins; shear strength; thermal conductivity; thermal stability; LED application; dicyandiamide resin; isotropy conductive adhesive; lap shear strength; latent curing agent; methylhexahydrophthalic anhydride; phenolic resin; thermal stability; volume resistivity; Conductive adhesives; Conductivity; Curing; Light emitting diodes; Materials; Packaging; Thermal stability; LED application; curing agent; isotropy conductive adhesives; reliabillity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials (APM), 2011 International Symposium on
  • Conference_Location
    Xiamen
  • ISSN
    1550-5723
  • Print_ISBN
    978-1-4673-0148-0
  • Type

    conf

  • DOI
    10.1109/ISAPM.2011.6105750
  • Filename
    6105750