DocumentCode
2686136
Title
Improvement of power integrity with novel segmented power bus structures in RF/digital SOP
Author
Li, Jun ; Wan, Lixi ; Gao, Wei ; Liao, Cheng
Author_Institution
Inst. of Electromagn., Southwest Jiaotong Univ., Chengdu
fYear
2008
fDate
28-31 July 2008
Firstpage
1
Lastpage
4
Abstract
With the voltage decreasing in power distribution network (PDN) in system-on-packages (SOPs), power integrity will be a critical issue. The cavity resonance modes between power and ground planes can be excited by simultaneous switching noise (SSN) or ground bounce noise (GBN) [1], [2]. To cut down the noise from susceptible devices, isolation techniques are necessary. In this paper, two novel structures combine segmented method and embedded capacitor provided isolation performances from 0.7 GHz to 10 GHz below -40 dB. The novel structures with a bridge for suppressing noise in high frequency and a thin high K dielectric substrate for decreasing the SSN in the entire frequency band. And they were better in performance and simpler in configuration than Electromagnetic Band Gap (EBG) and other isolation structures. Moreover, the analytical process could be a guidance to find better structures for improving the noise isolation.
Keywords
distribution networks; interference suppression; photonic band gap; system-in-package; dielectric substrate; electromagnetic band gap; frequency 0.7 GHz to 10 GHz; ground bounce noise; isolation techniques; noise suppression; power bus structures; power distribution network; power integrity; simultaneous switching noise; system-on-packages; Bridge circuits; Capacitors; Dielectric substrates; High K dielectric materials; High-K gate dielectrics; Periodic structures; Power systems; Radio frequency; Resonance; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-2739-0
Electronic_ISBN
978-1-4244-2740-6
Type
conf
DOI
10.1109/ICEPT.2008.4606977
Filename
4606977
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