• DocumentCode
    2686367
  • Title

    Fast transient simulation of multilayered power delivery network by using the stabilized explicit method

  • Author

    Sekine, Tadatoshi ; Asai, Hideki

  • Author_Institution
    Dept. of Mech. Eng., Shizuoka Univ., Hamamatsu, Japan
  • fYear
    2015
  • fDate
    15-21 March 2015
  • Firstpage
    253
  • Lastpage
    258
  • Abstract
    This paper describes an explicit transient analysis method stabilized for an arbitrary time step size for fast simulation of a multilayered power delivery network (PDN). A time step size used in an existing block-type leapfrog scheme is forced to be small if there exists small reactances in a circuit. Such small reactances are extracted from the small meshes, which are used to represent small apertures on the conductor planes. Therefore, the conditionally-stable explicit method is not suitable for the circuit including the small reactances. The stabilized explicit method (SEM) can remove instability related to the low reactances parts and enables to use a relatively-large time step size compared with the explicit leapfrog scheme. SEM is applied to transient simulations of an example multilayered PDN with a number of circular apertures to evaluate its adequacy. Numerical results show that our approach can perform much faster simulation than the block-type leapfrog scheme and a conventional SPICE-like simulator.
  • Keywords
    electronics packaging; equivalent circuits; power electronics; transient analysis; transients; arbitrary time step size; block-type leapfrog scheme; circular apertures; explicit transient analysis method; fast transient simulation; multilayered power delivery network; stabilized explicit method; Accuracy; Conductors; Eigenvalues and eigenfunctions; Equivalent circuits; Integrated circuit modeling; Mathematical model; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility and Signal Integrity, 2015 IEEE Symposium on
  • Conference_Location
    Santa Clara, CA
  • Print_ISBN
    978-1-4799-1992-5
  • Type

    conf

  • DOI
    10.1109/EMCSI.2015.7107695
  • Filename
    7107695