DocumentCode
2686674
Title
Molding compounds characteristics testing of plastic device used in high reliability fields
Author
Gao, Li
Author_Institution
China Electron. Standardization Inst., Beijing, China
fYear
2011
fDate
12-15 June 2011
Firstpage
1189
Lastpage
1192
Abstract
In recent years, with the plastic device materials and process progresses, the plastic device reliability has been improved. In this paper, the relationship between the characteristics of molding compounds and device reliability has been researched.
Keywords
integrated circuit packaging; materials testing; moulding; plastic packaging; reliability; high reliability fields; molding compound characteristic testing; plastic device materials; plastic device reliability; process progress; Absorption; Compounds; Corrosion; Moisture; Plastics; Reliability; Testing; ion content; moisture absorption; molding compound; reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability, Maintainability and Safety (ICRMS), 2011 9th International Conference on
Conference_Location
Guiyang
Print_ISBN
978-1-61284-667-5
Type
conf
DOI
10.1109/ICRMS.2011.5979490
Filename
5979490
Link To Document