• DocumentCode
    2686752
  • Title

    High-Power Power GaAs and High-Efficiency Ion-Implanted FETs for C and X Bands

  • Author

    Yanagawa, S. ; Yamada, Y. ; Itoh, M. ; Arai, K. ; Tomita, N.

  • fYear
    1985
  • fDate
    4-6 June 1985
  • Firstpage
    332
  • Lastpage
    335
  • Abstract
    C- and X-band multichip operation power GaAs FETs have been developed using an ion implantation technique. Uniformity among chips superior to and breakdown voltage comparable to those of conventional GaAs FETs have been obtained. The 4-chip C-band device, with a total gate width (Wg) of 57.6 mm, delivers a CW output power at 1-dB gain compression (P/sub 1dB/) of 21 W with 9 dB gain (G) and 42 % power-added efficiency (eta /sub add/), and a saturated output power (P/sub sat/) of 25 W at 5 GHz. The 8-chip X-band device with Wg=32 mm gives P/sub 1dB/=10.5 W with G=5 dB and eta/sub add/=25 %, and P/sub sat/=12 W at 10 GHz. The channel temperature rise is estimated from IR measurement to be 40 °C and 47 °C at 21-W and 10.5-W output power for the C- and X-band devices, respectively.
  • Keywords
    FETs; Gallium arsenide; Gold; Ion implantation; MOCVD; Microwave devices; Microwave theory and techniques; Power generation; Power measurement; Semiconductor device measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 1985 IEEE MTT-S International
  • Conference_Location
    St. Louis, MO, USA
  • ISSN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.1985.1131977
  • Filename
    1131977