• DocumentCode
    2686803
  • Title

    Multi-clock SOC test schedule based on TWC&S

  • Author

    Jinyi, Zhang ; Yanhui, Jiang ; Feng, Lin ; Jia, Wang ; Yan, Sun

  • Author_Institution
    Key Lab. of Adv. Displays & Syst. Applic., Shanghai Univ., Shanghai
  • fYear
    2008
  • fDate
    28-31 July 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Both wrapper and TAM are important components in SOC test architecture, and wrapper scan chain optimization and TAM optimization are NP-hard problems. Addressing wrapper scan chain optimization or TAM optimization separately leads to SOC test time sub-optimal. This paper presents a TWC&S (TAM/wrapper co-optimization and scheduling) algorithm for multi-clock SOC after combining the advantages of wrapper scan chain optimization and TAM optimization, and it aims to decrease test time of multi-clock SOC extremely. To demonstrate the validity of the proposed algorithm, experiment is performed on the multi-clock SOC MCDS2. The results show that there exist inflexion of test time, and the optimal test time is 23.2% when the widths of test bus are 20 vs. the least one. The phenomenon, decreasing degree of test time decreases slowly with test bus widths increase, demonstrates that trade-off will be achieved properly among test time, test area and design complexity.
  • Keywords
    circuit optimisation; integrated circuit testing; scheduling; system-on-chip; NP-hard problems; TAM optimization; multiclock SOC test schedule; system-on-chip; wrapper scan chain optimization; Analog integrated circuits; Circuit testing; Clocks; Design for testability; Design optimization; Digital integrated circuits; Laboratories; NP-hard problem; Optimization methods; Scheduling algorithm; TAM optimization; co-optimization; multi-clock SOC; scheduling; wrapper optimization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-2739-0
  • Electronic_ISBN
    978-1-4244-2740-6
  • Type

    conf

  • DOI
    10.1109/ICEPT.2008.4607019
  • Filename
    4607019