• DocumentCode
    2687524
  • Title

    Environmentally friendly electronics for high reliability

  • Author

    McElroy, J.B., Sr. ; Pfahl, R.C., Jr.

  • Author_Institution
    Int. Electron. Manuf. Initiative (iNEMI), Herndon, VA
  • fYear
    2008
  • fDate
    28-31 July 2008
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    In 2006 when the European Unionpsilas RoHS Regulation went into effect, a number of global firms who produce high-reliability products such as servers and telecommunication equipment had decided to take the exemption allowed for Pb containing solders in these applications. As a result they had not completed the tests necessary to prove the reliability of Tin Silver Copper (SAC) alloys in these applications. In 2007 it became apparent to many of these firms that they could no longer procure components with traditional SnPb surface finishes, and thus they faced an unknown reliability risk. In 2006 iNEMI had begun a study to evaluate the reliability of ldquoPb-Free BGAs in SnPb Assemblies.rdquo This paper will report on the results of this initial study and will then report on several studies currently under way to evaluate the reliability of new green-materials in high-reliability applications.
  • Keywords
    RoHS compliance; ball grid arrays; electronics industry; reliability; RoHS regulation exemption; SnPb; environmentally friendly electronics; green-material; high reliability electronics; lead free BGA; reliability risk; Assembly; Consumer electronics; Copper alloys; Electronic equipment manufacture; Mission critical systems; Robustness; Silver; Supply chains; Surface finishing; Tin alloys;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-2739-0
  • Electronic_ISBN
    978-1-4244-2740-6
  • Type

    conf

  • DOI
    10.1109/ICEPT.2008.4607068
  • Filename
    4607068