• DocumentCode
    2688385
  • Title

    WAVETM technology for wafer level packaging of ICs

  • Author

    Fjelstad, Joseph

  • Author_Institution
    Tessera Inc., San Jose, CA, USA
  • fYear
    1998
  • fDate
    8-10 Dec 1998
  • Firstpage
    214
  • Lastpage
    218
  • Abstract
    Wide area vertical expansion (WAVE) technology promises to provide a relatively easy method for cost effectively interconnecting ICs while still on the wafer. Based on concepts that allow for the mass assembly and production of compliant packages on the wafer, this important new technology is described in terms of the process and device, and the implications and future directions of the technology are examined
  • Keywords
    assembling; integrated circuit interconnections; integrated circuit manufacture; integrated circuit packaging; technological forecasting; IC interconnection; WAVE technology; compliant packages; cost effectiveness; mass assembly; mass production; wafer level IC packaging; wide area vertical expansion technology; Assembly; Chip scale packaging; Electron tubes; Electronics packaging; Integrated circuit packaging; Semiconductor device packaging; Silicon; Substrates; Transistors; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference, 1998. Proceedings of 2nd
  • Print_ISBN
    0-7803-5141-X
  • Type

    conf

  • DOI
    10.1109/EPTC.1998.756004
  • Filename
    756004
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2688385