Measurement on thermal properties of solid films in electronic packages

Author

Shi, X.Q. ; Pang, H.L.J. ; Zhou, W. ; Yang, Q.J.

Author_Institution

Gintic Inst. of Manuf. Technol., Singapore

fYear

1998

fDate

8-10 Dec 1998

Firstpage

308

Lastpage

312

Abstract

A real-time holographic interferometry computer-aided-measurement system for measurement of the thermal properties of solid films has been established. The two principal problems of heat loss and edge reflection and their effects on measurement accuracy were analysed. With this new method, films commonly used in electronic packages, such as aluminium, copper, silicon, nickel, molybdenum, 63Sn/37Pb solder alloy, and FR-4, with various coefficients of thermal expansion ranging from 2.5 ppm/°C to 25 ppm/°C and thermal conductivities ranging from 0.2 W/m-K to 380 W/m-K, were measured. The experimental results show that this system has a high measurement accuracy and a wide measurement range for both coefficient of thermal expansion and thermal conductivity

Keywords

assembling; dielectric thin films; holographic interferometry; integrated circuit measurement; integrated circuit metallisation; integrated circuit packaging; metallic thin films; printed circuits; semiconductor thin films; soldering; thermal conductivity measurement; thermal expansion measurement; Al; Cu; FR-4 film; Mo; Ni; Si; SnPb; SnPb solder alloy; aluminium film; coefficient of thermal expansion; copper film; edge reflection; electronic package films; electronic packages; heat loss; measurement accuracy; measurement range; microelectronic packaging; molybdenum film; nickel film; real-time holographic interferometry computer-aided-measurement system; silicon film; solid films; thermal conductivity; thermal properties; thermal properties measurement; Conductivity measurement; Electronic packaging thermal management; Holography; Interferometry; Optical films; Real time systems; Reflection; Solids; Thermal conductivity; Thermal expansion;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 1998. Proceedings of 2nd

Print_ISBN

0-7803-5141-X

Type

conf

DOI

10.1109/EPTC.1998.756021

Filename

756021