Robust loop parameters for ball neck strength enhancement [package wire bonding]

Author

Liu, Hongying ; Ong, Dr S H ; Tang, L.C.

Author_Institution

STMicroelectron. Pte. Ltd., Singapore

fYear

1998

fDate

8-10 Dec 1998

Firstpage

313

Lastpage

317

Abstract

A fractional factorial designed experiment was carried out to study the wire neck strength of gold ball bonding for the QFP160L package. Five wire loop parameters, reverse length (RL), reverse height (RH), loop height (LH), ball security height (BSH) and loop factor A (A), were evaluated. The wire neck strength of the gold ball was measured by the wire pull test. In addition, temperature cycling was used as a means to study the reliability of wire neck formation. Analysis of the results shows the following conclusions: (1) RL should be set at a low level to prevent violent bending on the wire neck area; (2) high settings of A and RH can provide stronger wire neck strength; (3) BSH should be set lower than RH; (4) LH did not have much effect on the wire neck strength. The fractional factorial design proved to be extremely useful in optimization of the wire bonding operation and made future fire-fighting for line issues easier

Keywords

bending; design of experiments; gold; integrated circuit bonding; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; lead bonding; mechanical strength; mechanical testing; optimisation; thermal stresses; Au; QFP160L package; ball neck strength enhancement; ball security height; fractional factorial design; fractional factorial designed experiment; gold ball; gold ball bonding; loop factor A; loop height; loop parameters; package wire bonding; reliability; reverse height; reverse length; temperature cycling; violent wire neck area bending; wire bonding optimization; wire loop parameters; wire neck formation; wire neck strength; wire pull test; Bonding; Design optimization; Gold; Neck; Packaging; Robustness; Security; Temperature; Testing; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 1998. Proceedings of 2nd

Print_ISBN

0-7803-5141-X

Type

conf

DOI

10.1109/EPTC.1998.756022

Filename

756022