DocumentCode
2688764
Title
Influence of underfill methods on the solder joint fatigue of wafer level packaging
Author
Regard, Charles ; Gautier, Christian ; Fremont, Hélène ; Poirier, Patrick
Author_Institution
Quality & Anal. Service, NXP Semicond., Caen
fYear
2008
fDate
28-31 July 2008
Firstpage
1
Lastpage
6
Abstract
To increase miniaturization, CSWLP (chip size wafer level packaging) has been developed. However, the difficulty to get good solder joint reliability leads to manufacture only small CSWLP modules. Different underfill methods are evaluated here, by measurements and simulations: results prove that underfill is necessary, but a bad choice can also decrease the reliability. An original method called ldquore-enforcementrdquo improves the life time.
Keywords
integrated circuit reliability; modules; soldering; wafer level packaging; CSWLP modules; chip size wafer level packaging; re-enforcement; solder joint fatigue; solder joint reliability; underfill methods; Assembly; Electronics packaging; Fatigue; Lead; Manufacturing processes; Silicon; Soldering; Testing; US Department of Energy; Wafer scale integration; CSWLP; Re-enforcement; Reliability; Thermal shock; Underfill;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging, 2008. ICEPT-HDP 2008. International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-2739-0
Electronic_ISBN
978-1-4244-2740-6
Type
conf
DOI
10.1109/ICEPT.2008.4607137
Filename
4607137
Link To Document