• DocumentCode
    2689378
  • Title

    Perspective service knowledge and technology transfer in IC firm

  • Author

    Chen, Yu-Shan ; Yu-Shan Chen ; Hung, Mark

  • Author_Institution
    Dept. of Bus. Adm., Asia Univ., Taichung, Taiwan
  • fYear
    2009
  • fDate
    8-10 June 2009
  • Firstpage
    804
  • Lastpage
    809
  • Abstract
    This study is based on a case study on a recent knowledge and technology transfer in the IC firms and interesting insights gained. The transfer methodology and the performance were investigated. Based on an in depth evaluation of the project setup and a lessons learned workshop after the project, improvements to the project setup are proposed. The IC firm extends semiconductor manufacturing sites (wafer fabs) for rapidly growing IC market. One multi national companies built new fabs and have to transfer the manufacturing knowledge and technology to new sub-fabs. This study purpose is to propose an efficient methodology for multinational intra-firm knowledge and technology transfer (MIFKTT) in the IC firms.
  • Keywords
    globalisation; integrated circuit manufacture; knowledge management; production facilities; project management; semiconductor industry; technology transfer; integrated circuit firm; manufacturing knowledge transfer; multinational companies; perspective service knowledge transfer; project management; semiconductor manufacturing sites; technology transfer methodology; wafer fabrication; Asia; Companies; Humans; Integrated circuit modeling; Isolation technology; Licenses; Mass production; Semiconductor device manufacture; Semiconductor device modeling; Technology transfer; IC-Industry; Intra-firm; Multinational; Technology transfer; knowledge transfer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Service Systems and Service Management, 2009. ICSSSM '09. 6th International Conference on
  • Conference_Location
    Xiamen
  • Print_ISBN
    978-1-4244-3661-3
  • Electronic_ISBN
    978-1-4244-3662-0
  • Type

    conf

  • DOI
    10.1109/ICSSSM.2009.5174991
  • Filename
    5174991