• DocumentCode
    2690921
  • Title

    Investigation on the flow properties of BPSG films

  • Author

    Tsai, Y.H. ; Hsu, S.L. ; Tseng, F.C. ; Yoo, C.S.

  • Author_Institution
    Taiwan Semicond. Manuf. Co., Hsin-Chu, Taiwan
  • fYear
    1989
  • fDate
    17-19 May 1989
  • Firstpage
    83
  • Lastpage
    88
  • Abstract
    The effects of various borophosphosilicate glass (BPSG) film postgrowth treatments on the film after-flow angles have been explored with ESCA (electron spectroscopy for chemical analysis) and FTIR (Fourier transform infrared spectroscopy). The experimental results show that longer delay times result in larger after-flow angles. Films after deionized water rinse give rise to a reentrant angle at the film-substrate interface. Different flow ambients also result in slightly different after-flow angles. ESCA and FTIR spectra show that the after-flow angle changes are due to the chemical changes on the film surface. Proper film postgrowth treatments are proposed to obtain proper after-flow angles to avoid discontinuity in metal layer deposition
  • Keywords
    Fourier transform spectra; X-ray photoelectron spectra; borosilicate glasses; electron spectroscopy; flow; infrared spectra of inorganic solids; insulating thin films; phosphosilicate glasses; semiconductor technology; spectrochemical analysis; B2O3-P2O5-SiO2; BPSG films; ESCA; ESCA spectra; FTIR spectra; Fourier transform infrared spectroscopy; borophosphosilicate glass; chemical analysis; delay times; electron spectroscopy; film after-flow angles; film surface chemical changes; film-substrate interface; flow ambients; flow properties; postgrowth treatments; reentrant angle; Aluminum; Atmospheric-pressure plasmas; Boats; Delay; Fluid flow; Furnaces; Plasma density; Plasma temperature; Production; Semiconductor films;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems and Applications, 1989. Proceedings of Technical Papers. 1989 International Symposium on
  • Conference_Location
    Taipei
  • Type

    conf

  • DOI
    10.1109/VTSA.1989.68588
  • Filename
    68588