Advanced packaging technologies-an overview

The advanced packaging technologies that can be expected in high-performance systems in the 1990s are discussed in terms of chip connection, power distribution, heat removal, thick- and thin-film wiring, and package interconnections. Some logical trends in each of the major packaging technologies are projected, including chip-level connection providing the required connections between the chip and the package; power distribution to the chip and heat removal from the chip; first-level packages providing all the necessary wiring, interconnections, and power distribution; first-to-second-level interconnections; and second-level packages providing all the necessary wiring, connections, power distribution, and power supply connection. Optical interconnections are also discussed.<>