Thermal stress analysis of plastic leaded chip carriers

Author

Lau, John H.

Author_Institution

Hewlett-Packard Co., Palo Alto, CA, USA

fYear

1990

fDate

23-25 May 1990

Firstpage

57

Lastpage

66

Abstract

The thermal stresses of molded plastic chip carriers (MPCCs) such as the plastic quad flat pack (PQFD) and plastic leaded chip carriers (PLCCs) are studied using the finite-element method. Two different types of lead frame materials are considered, alloy-42 and copper. The predicted failure mechanism agrees well with experimental data. In addition, a dual-inline package (DIP) with two different molded plastics is analyzed, and the stress results obtained by the finite-element method are found to be in excellent agreement with the experimental results. The results presented provide a better understanding of the thermal behavior of molded plastic packages and demonstrate the feasibility of using the finite-element method to design such electronic packaging

Keywords

failure analysis; integrated circuit technology; packaging; reliability; thermal stresses; Cu lead frame; DIP; MPCCs; PLCCs; PQFD; alloy-42; dual-inline package; experimental data; experimental results; finite-element method; lead frame materials; molded plastic chip carriers; molded plastic packages; molded plastics; plastic leaded chip carriers; plastic quad flat pack; predicted failure mechanism; thermal stress analysis; Electronic packaging thermal management; Electronics packaging; Finite element methods; Lead; Plastic packaging; Space heating; Thermal conductivity; Thermal expansion; Thermal force; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Phenomena in Electronic Systems, 1990. I-THERM II., InterSociety Conference on

Conference_Location

Las Vegas, NV

Type

conf

DOI

10.1109/ITHERM.1990.113311

Filename

113311