Monte Carlo thermal optimization of populated printed circuit board

Author

Eliasi, R. ; Elperin, T. ; BarCohen, A.

Author_Institution

Dept. of Mech. Eng., Ben-Gurion Univ. of the Negev, Beer Sheva, Israel

fYear

1990

fDate

23-25 May 1990

Firstpage

74

Lastpage

84

Abstract

The methodology and results of a Monte Carlo optimization of component placement on a printed circuit board are presented. The overall reliability of the component mix on the printed circuit board is the criterion of optimality. Arrhenius relations are used to quantify the effect of temperature on the component failure rate. The finite-element code ANSYS is used to determine the temperature distribution in two conductively cooled printed circuit boards. The various strategies of the Monte Carlo annealing optimization and the effect of the relevant parameters on board reliability are discussed

Keywords

Monte Carlo methods; circuit layout CAD; optimisation; printed circuit design; simulated annealing; Arrhenius relations; Monte Carlo annealing optimization; Monte Carlo thermal optimization; board reliability; component failure rate; conductively cooled printed circuit boards; criterion of optimality; effect of temperature; finite-element code ANSYS; optimization of component placement; overall reliability; populated printed circuit board; Acceleration; Electronic packaging thermal management; Electronics packaging; Mechanical engineering; Microelectronics; Monte Carlo methods; Optimization methods; Packaging machines; Printed circuits; Temperature distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Phenomena in Electronic Systems, 1990. I-THERM II., InterSociety Conference on

Conference_Location

Las Vegas, NV

Type

conf

DOI

10.1109/ITHERM.1990.113313

Filename

113313