DocumentCode
2696115
Title
Boiling incipience and nucleate boiling heat transfer of highly-wetting dielectric fluids from electronic materials
Author
You, S.M. ; BarCohen, A. ; Simon, T.W.
Author_Institution
Dept. of Mech. Eng., Minnesota Univ., Minneapolis, MN, USA
fYear
1990
fDate
23-25 May 1990
Firstpage
90
Lastpage
96
Abstract
An experimental study of pool boiling was conducted using cylindrical heater surfaces of platinum, silicon, silicon dioxide, and aluminum oxide. They were immersed in FC-72 and R-113, saturated at 1-a.t.m. pressure. The effects of fluid and surface material on boiling incipience and on the nucleate boiling curve was investigated. A probabilistic representation was used to present the incipience wall superheat values, which scattered widely for ostensibly identical runs. The difference in incipience wall superheat values between those with FC-72 and R-113 was significant, but the surface material effect on boiling incipience was small. The surface material effect was more pronounced in the nucleate boiling regime than on the incipience process
Keywords
boiling; cooling; heat transfer; packaging; Al2O3; FC-72; Pt; R-113; Si; SiO2; boiling incipience; cylindrical heater surfaces; electronic materials; experimental study; highly-wetting dielectric fluids; incipience process; incipience wall superheat values; nucleate boiling curve; nucleate boiling heat transfer; nucleate boiling regime; pool boiling; probabilistic representation; surface material effect; Aluminum oxide; Conducting materials; Dielectric materials; Heat transfer; Platinum; Rough surfaces; Silicon compounds; Surface resistance; Surface roughness; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal Phenomena in Electronic Systems, 1990. I-THERM II., InterSociety Conference on
Conference_Location
Las Vegas, NV
Type
conf
DOI
10.1109/ITHERM.1990.113316
Filename
113316
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