• DocumentCode
    2696115
  • Title

    Boiling incipience and nucleate boiling heat transfer of highly-wetting dielectric fluids from electronic materials

  • Author

    You, S.M. ; BarCohen, A. ; Simon, T.W.

  • Author_Institution
    Dept. of Mech. Eng., Minnesota Univ., Minneapolis, MN, USA
  • fYear
    1990
  • fDate
    23-25 May 1990
  • Firstpage
    90
  • Lastpage
    96
  • Abstract
    An experimental study of pool boiling was conducted using cylindrical heater surfaces of platinum, silicon, silicon dioxide, and aluminum oxide. They were immersed in FC-72 and R-113, saturated at 1-a.t.m. pressure. The effects of fluid and surface material on boiling incipience and on the nucleate boiling curve was investigated. A probabilistic representation was used to present the incipience wall superheat values, which scattered widely for ostensibly identical runs. The difference in incipience wall superheat values between those with FC-72 and R-113 was significant, but the surface material effect on boiling incipience was small. The surface material effect was more pronounced in the nucleate boiling regime than on the incipience process
  • Keywords
    boiling; cooling; heat transfer; packaging; Al2O3; FC-72; Pt; R-113; Si; SiO2; boiling incipience; cylindrical heater surfaces; electronic materials; experimental study; highly-wetting dielectric fluids; incipience process; incipience wall superheat values; nucleate boiling curve; nucleate boiling heat transfer; nucleate boiling regime; pool boiling; probabilistic representation; surface material effect; Aluminum oxide; Conducting materials; Dielectric materials; Heat transfer; Platinum; Rough surfaces; Silicon compounds; Surface resistance; Surface roughness; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Phenomena in Electronic Systems, 1990. I-THERM II., InterSociety Conference on
  • Conference_Location
    Las Vegas, NV
  • Type

    conf

  • DOI
    10.1109/ITHERM.1990.113316
  • Filename
    113316