Point source thermal response of five-layer anisotropic plate structures

Author

Min, Y. Jay ; Palisoc, Arthur L. ; Lee, Chin C.

Author_Institution

Dept. of Electr. & Comput. Eng., California Univ., Irvine, CA, USA

fYear

1990

fDate

23-25 May 1990

Firstpage

149

Lastpage

153

Abstract

The transfer function of a five-layer anisotropic composite structure is derived. Using the inverse Fourier transform, the point source thermal response of the structure is obtained. The availability of this point source response simplifies the computation of the parameters of the unit thermal profile for real-time thermal design. For structures having embedded heat sources of arbitrary geometries, the temperature solution can be derived using the inverse Fourier transform method or the convolution method, thus greatly extending the type of electron devices which can be studied using analytical methods

Keywords

cooling; electronic engineering computing; packaging; thermal resistance; analytical methods; anisotropic composite structure; convolution method; electron device types extension; embedded heat sources; five-layer anisotropic plate structures; inverse Fourier transform; point source thermal response; real-time thermal design; temperature solution; transfer function; unit thermal profile; Anisotropic magnetoresistance; Convolution; Electronic packaging thermal management; Fourier transforms; Geometrical optics; Heat transfer; Integrated circuit packaging; Shape; Temperature; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Phenomena in Electronic Systems, 1990. I-THERM II., InterSociety Conference on

Conference_Location

Las Vegas, NV

Type

conf

DOI

10.1109/ITHERM.1990.113325

Filename

113325