• DocumentCode
    2700970
  • Title

    A novel passive haptic device for simulating a broad range of impedances

  • Author

    Lightcap, Chris A. ; Kang, Hyosig

  • Author_Institution
    MAKO Surg. Corp, Fort Lauderdale, FL, USA
  • fYear
    2011
  • fDate
    9-13 May 2011
  • Firstpage
    925
  • Lastpage
    930
  • Abstract
    The strength of a haptic display may be assessed from its range of stable impedances. This paper presents a novel passive haptic display (PARM) capable of simulating a broad range of impedances. It comprises a passive constraint that can simulate both uninhibited motion through free-space and collision into a rigid obstacle. In free-space, the user feels the natural impedance of the end-effector without the added inertia and friction from a transmission or actuator. In a collision with a rigid object, haptic stiffness can be much greater than a traditional impedance haptic display. An experimental study with a 2 DoF planar manipulator illustrates the minimum and maximum impedances that are attainable for this haptic display. The inertial mass and friction in free-space are less than 0.2 kg and 12.3 Ns/m, and the stiffness against a haptic boundary is 465 N/mm. In addition, collision with a haptic object produces a more authentic experience, since there are naturally-occurring high frequency oscillations that result from the physical collision between two objects. This novel haptic display has both the minimum impedance benefits of impedance haptic displays and the maximum impedance benefits of admittance haptic displays.
  • Keywords
    display instrumentation; end effectors; haptic interfaces; stability; 2 DoF planar manipulator; PARM; admittance haptic displays; end-effector; haptic stiffness; impedance haptic display; inertial mass; maximum impedance benefits; passive haptic device; Admittance; Damping; Friction; Haptic interfaces; Impedance; Kinematics; Lead;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Robotics and Automation (ICRA), 2011 IEEE International Conference on
  • Conference_Location
    Shanghai
  • ISSN
    1050-4729
  • Print_ISBN
    978-1-61284-386-5
  • Type

    conf

  • DOI
    10.1109/ICRA.2011.5980379
  • Filename
    5980379