• DocumentCode
    2701580
  • Title

    Develop Of Thick Copper Film Metallized Alumina Substrate for Small Size, High Power, On-Board Power Supply

  • Author

    Tedoriya, Kauo ; Kanamaru, Akira ; Mohri, Mamoru

  • fYear
    1993
  • fDate
    9-11 Jun 1993
  • Firstpage
    73
  • Lastpage
    76
  • Keywords
    Bonding; Circuits; Copper; Lamination; Metallization; Positron emission tomography; Power supplies; Slurries; Substrates; Switching frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
  • Print_ISBN
    0-7803-1432-8
  • Type

    conf

  • DOI
    10.1109/IEMT.1993.639354
  • Filename
    639354
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2701580