• DocumentCode
    2701640
  • Title

    Evaluation of wiring constructions for space applications

  • Author

    Hammoud, Ahmad N. ; Stavnes, Mark W. ; Dickman, John E. ; Burkhardt, Linda A. ; Woodford, Lynn M. ; Ide, James R. ; Muegge, Ed

  • Author_Institution
    NASA Lewis Res. Center, Brook Park, OH, USA
  • fYear
    1994
  • fDate
    5-8 Jun 1994
  • Firstpage
    592
  • Lastpage
    595
  • Abstract
    A NASA Office of Safety and Mission Assurance (OS&MA) program to develop lightweight, reliable, and safe wiring insulations for aerospace applications is being performed by the NASA Lewis Research Center (LeRC). As part of this effort, a new wiring construction utilizing high strength PTFE (Poly Tetrafluoroethylene) as the insulation has been tested and compared with the existing military standard polyimide-based MIL-W-81381 wire construction. Electrical properties which were investigated included ac corona inception and extinction voltages (sea level and 60.000 feet), time/current to smoke, and wire fusing time. The two constructions were also characterized in terms of their mechanical properties of flexural strength, abrasion resistance (23°C and 150°C), and dynamic cut-through (23°C to 200°C). The results obtained in this testing effort are presented and discussed in this paper
  • Keywords
    abrasion; aerospace testing; bending strength; cable insulation; corona; insulation testing; polyethylene insulation; wiring; 23 to 200 degC; PTFE; abrasion resistance; ac corona extinction voltages; ac corona inception voltages; dynamic cut-through; flexural strength; mechanical properties; polytetrafluoroethylene; space applications; wire fusing time; wiring constructions; wiring insulations; Aerospace safety; Aerospace testing; Cable insulation; Corona; Insulation testing; Military standards; NASA; Voltage; Wire; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 1994., Conference Record of the 1994 IEEE International Symposium on
  • Conference_Location
    Pittsburgh, PA
  • ISSN
    1089-084X
  • Print_ISBN
    0-7803-1942-7
  • Type

    conf

  • DOI
    10.1109/ELINSL.1994.401385
  • Filename
    401385