• DocumentCode
    2701736
  • Title

    Characterization of silver flakes utilized for isotropic conductive adhesives

  • Author

    Markley, Deanna L. ; Tong, Quinn K. ; Magliocca, Dorothy J. ; Hahn, Thomas D.

  • Author_Institution
    Corporate Res., Nat. Starch & Chem. Co., Bridgewater, NJ, USA
  • fYear
    1999
  • fDate
    14-17 Mar 1999
  • Firstpage
    16
  • Lastpage
    20
  • Abstract
    Silver (Ag) flakes are widely used as conductive fillers for isotropic conductive adhesives. Silver provides superior conductivity and has reasonable costs associated with it compared to other precious metals utilized in the electronics industry. As a result, production of silver flakes and powders has developed into an industry of its own. The silver fillers are typically fabricated into flakes and lubricated with certain organic compounds such as fatty acids. The organic lubricants on the surface of silver flakes play an important role in the performance of isotropic conductive adhesives. In particular, improvements in rheology and electrical conductivity have been observed. However, the exact nature of the lubricants on the silver flake surface and their impact on the adhesive rheology and conductivity have not been fully understood. This study identified the structure of the organic lubricants on the silver flake surface. The results using DSC (differential scanning calorimetry), XPS (X-ray photoelectron spectroscopy), SEM (scanning electron microscopy), Raman spectroscopy, and DRIFTS (diffuse reflectance infrared Fourier transform spectroscopy) techniques to characterize silver flakes are discussed in detail
  • Keywords
    Fourier transform spectra; Raman spectra; X-ray photoelectron spectra; adhesives; conducting polymers; differential scanning calorimetry; electrical conductivity; filled polymers; lubrication; powder metallurgy; rheology; scanning electron microscopy; silver; surface mount technology; Ag; Ag flakes; DRIFTS; DSC; Raman spectroscopy; SEM; X-ray photoelectron spectroscopy; XPS; adhesive conductivity; adhesive rheology; conductive fillers; conductivity; differential scanning calorimetry; diffuse reflectance infrared Fourier transform spectroscopy; electrical conductivity; electronics industry; fatty acid lubricants; isotropic conductive adhesives; lubricants; material costs; organic lubricants; precious metals; rheology; scanning electron microscopy; silver fillers; silver flake surface; silver flake surface lubricants; silver flakes; silver powders; Conductive adhesives; Conductivity; Costs; Infrared spectra; Lubricants; Raman scattering; Rheology; Scanning electron microscopy; Silver; Spectroscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on
  • Conference_Location
    Braselton, GA
  • Print_ISBN
    0-930815-56-4
  • Type

    conf

  • DOI
    10.1109/ISAPM.1999.757280
  • Filename
    757280