Recent achievement in microstructure investigation of Sn0.5Cu3.4Ag lead-free alloy by adding boron

Author

Ye, Lilei ; Lai, Zonghe ; Liu, Johan ; Thölén, Anders

Author_Institution

Dept. of Exp. Phys., Chalmers Univ. of Technol., Goteborg, Sweden

fYear

1999

fDate

14-17 Mar 1999

Firstpage

262

Lastpage

267

Abstract

Inhomogenous microstructural coarsening sites are known to be preferred sites for initiation of creep and fatigue cracks. Thus, one of the keys to improved solder-joint reliability is the ability to control and stabilize a uniform microstructure. This study involves alloying small quantities of boron into the Sn-Cu-Ag system with the aim to improve the microstructure of these solders. Several analytical methods, such as SEM, TEM and SIMS, were employed to investigate the distribution and microstructure of alloying elements in the Sn-Cu-Ag system

Keywords

boron alloys; circuit reliability; copper alloys; creep; crystal microstructure; environmental factors; fatigue cracks; packaging; scanning electron microscopy; secondary ion mass spectra; silver alloys; soldering; tin alloys; transmission electron microscopy; Sn-Cu-Ag system; SnCuAg; SnCuAg lead-free solder alloy; SnCuAgB; alloying element distribution; alloying elements; boron addition; boron alloying; creep; fatigue cracks; inhomogenous microstructural coarsening sites; microstructure investigation; solder microstructure; solder-joint reliability; uniform microstructure; Boron alloys; Copper; Creep; Environmentally friendly manufacturing techniques; Lead; Microstructure; Powders; Scanning electron microscopy; Temperature; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-930815-56-4

Type

conf

DOI

10.1109/ISAPM.1999.757324

Filename

757324