DocumentCode
2702815
Title
Separation of low molecular siloxanes for electronic application by liquid-liquid extraction [packaging materials]
Author
Urasaki, Naoyuki ; Wong, C.P.
Author_Institution
Hitachi Chem. Co. Ltd., Ibaraki, Japan
fYear
1999
fDate
14-17 Mar 1999
Firstpage
351
Lastpage
355
Abstract
Silicone resins are widely used for electronic packaging as potting and encapsulating materials. Silicone resins have many advantages for electronic packaging applications such as superior electrical properties, thermal stability, low water absorption, etc. Silicone resins are not only used as protective materials for IC devices but also as conducting materials for interconnection. However, silicone resins have two big drawbacks: low adhesion strength and low molecular weight creep. A simple liquid-liquid extraction method has been developed to purify silicone resins, which improves adhesion strength and eliminates low molecular weight creep. This paper describes the results of the liquid-liquid extraction method to remove low molecular weight cyclic siloxanes. Fourier transform-infrared (FTIR) spectroscopy was used to monitor the removal rate of low molecular weight cyclic siloxanes. Thermogravimetric analysis (TGA) was used to evaluate the purity of the silicone resin. Gas chromatography-mass spectrometry (GC-MS) was used to identify the low molecular weight cyclic siloxanes
Keywords
Fourier transform spectra; adhesion; chromatography; conducting polymers; creep; encapsulation; integrated circuit interconnections; integrated circuit packaging; molecular weight; protective coatings; separation; silicones; spectrochemical analysis; thermal analysis; thermal stability; FTIR spectroscopy; Fourier transform-infrared spectroscopy; GC-MS; IC devices; TGA; adhesion strength; conducting materials; electrical properties; electronic application; electronic packaging; electronic packaging applications; encapsulating materials; gas chromatography-mass spectrometry; interconnection; liquid-liquid extraction; liquid-liquid extraction method; low molecular siloxane separation; low molecular weight creep; low molecular weight cyclic siloxanes; packaging materials; potting materials; protective materials; removal rate; silicone resin purification; silicone resin purity; silicone resins; thermal stability; thermogravimetric analysis; water absorption; Absorption; Adhesives; Conducting materials; Creep; Electronic packaging thermal management; Electronics packaging; Resins; Spectroscopy; Thermal stability; Water;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties and Interfaces, 1999. Proceedings. International Symposium on
Conference_Location
Braselton, GA
Print_ISBN
0-930815-56-4
Type
conf
DOI
10.1109/ISAPM.1999.757337
Filename
757337
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