• DocumentCode
    2702917
  • Title

    Tolerance of performance degrading faults for effective yield improvement

  • Author

    Hsieh, Tong Yu ; Breuer, Melvin A. ; Annavaram, Murali ; Gupta, Sandeep K. ; Lee, Kuen Jong

  • Author_Institution
    Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
  • fYear
    2009
  • fDate
    1-6 Nov. 2009
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    To provide a new avenue for improving yield for nano-scale fabrication processes, we introduce a new notion: performance degrading faults (pdef). A fault is said to be a pdef if it cannot cause a functional error at system outputs but may result in system performance degradation. In a processor, a fault is a pdef if it causes no error in the execution of user programs but may reduce performance, e.g., decrease the number of instructions executed per cycle. By identifying faulty chips that contain pdef´s that degrade performance within some limits and binning these chips based on the their resulting instruction throughput, effective yield can be improved in a radically new manner that is completely different from the current practice of performance binning on clock frequency. To illustrate the potential benefits of this notion, we analyze the faults in the branch prediction unit of a processor. Experimental results show that every stuck-at fault in this unit is a pdef. Furthermore, 97% of these faults induce almost no performance degradation.
  • Keywords
    fault diagnosis; fault tolerance; logic testing; performance evaluation; branch prediction unit; clock frequency; effective yield improvement; faulty chips; nanoscale fabrication process; performance binning; performance degrading fault tolerance; processor; stuck-at fault; Circuit faults; Circuit testing; Clocks; Degradation; Design for testability; Error correction; Error correction codes; Fabrication; Fault detection; System performance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2009. ITC 2009. International
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-4868-5
  • Electronic_ISBN
    978-1-4244-4867-8
  • Type

    conf

  • DOI
    10.1109/TEST.2009.5355594
  • Filename
    5355594