DocumentCode
2704144
Title
Simulation of three-dimensional wirebond deformation during transfer molding
Author
Tay, A.A.O. ; Yeo, K.S. ; Wu, J.H.
Author_Institution
Centre for IC failure Anal. & Reliability, Nat. Univ. of Singapore, Singapore
fYear
1995
fDate
21-24 May 1995
Firstpage
999
Lastpage
1004
Abstract
During the transfer molding process, flow induced forces act on the wirebonds causing them to deform. If the deformation is excessive, package failure may arise. This paper describes the computer simulation of three-dimensional wirebond deformation using a boundary integral method. The accuracy of the method was verified by experiment. The method was then applied to a case study involving a 25-leaded IC package
Keywords
boundary integral equations; digital simulation; failure analysis; integrated circuit packaging; lead bonding; plastic packaging; IC package; boundary integral method; computer simulation; flow induced forces; package failure; three-dimensional wirebond deformation; transfer molding; Bonding forces; Creep; Deformable models; Geometry; Integrated circuit packaging; Laplace equations; Predictive models; Solid modeling; Transfer molding; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-2736-5
Type
conf
DOI
10.1109/ECTC.1995.517812
Filename
517812
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