Switching noise in ECL packaging and interconnect systems

Author

Sandborn, Peter A. ; Hashemi, Hassan ; Ziai, Kamran

Author_Institution

Microelectron. & Comput. Technol. Corp., Austin, TX, USA

fYear

1990

fDate

17-18 Sep 1990

Firstpage

148

Lastpage

151

Abstract

Switching noise in ECL (emitter coupled logic) circuits and their associated packaging and interconnect systems has been studied. The relative effectiveness of including bypass capacitors, complementary outputs, DC termination planes, and active regulation was evaluated as a function of edge rate and packaging parasitics. The simulation of a single ECL gate is discussed. For more than one gate switching simultaneously the functional dependence of the noise on the number of switching gates depends on the specific system design. An example of multiple switching gates is presented

Keywords

bipolar integrated circuits; electron device noise; emitter-coupled logic; integrated logic circuits; packaging; switching; DC termination planes; ECL gate; ECL packaging; active regulation; bypass capacitors; complementary outputs; edge rate; emitter coupled logic; interconnect systems; multiple switching gates; packaging parasitics; simulation; switching noise; Capacitors; Circuit noise; Crosstalk; Driver circuits; Integrated circuit interconnections; Logic; Packaging; Switches; Switching circuits; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Bipolar Circuits and Technology Meeting, 1990., Proceedings of the 1990

Conference_Location

Minneapolis, MN

Type

conf

DOI

10.1109/BIPOL.1990.171149

Filename

171149