DocumentCode
2705826
Title
Research on effect of measured curvature on eddy current evaluation by finite element analysis
Author
Yating, Yu ; Pingan, Du ; Mingquan, Shi
Author_Institution
Sch. of Mechatron. Electron. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu
fYear
2008
fDate
21-24 April 2008
Firstpage
1
Lastpage
6
Abstract
Presently, eddy current evaluation has been used in many engineering fields, such as flaw or cracks testing, distance measurement, and material properties measurement. However, eddy current testing is sensitive to multiple parameters, e.g. the sensor lift-off, and the measured curvature, the electromagnetic properties of measured. In this paper, the finite element model of sensor under spheroid and cylinder are built firstly. Then the finite element formulation of coil impedance is carried out. Finally, the effect of the measured curvature on the planar coil impedance, the electromagnetic field distribution of sensor, the eddy current distribution in measured are investigated by finite element analysis, respectively. The conclusions are shown that (1) whenever the measured is convex or concave, the effect trend of measured curvature is almost the same under the nonmagnetic measured; (2) the influence of the measured curvature is different when the measured is magnetic. Therefore, it is necessary to take different measures to correct the curvature effects on different measured.
Keywords
eddy current testing; finite element analysis; coil impedance; curvature effects; eddy current distribution; eddy current evaluation; eddy current sensor; finite element analysis; planar coil impedance; sensor electromagnetic field distribution; Coils; Current measurement; Distance measurement; Eddy current testing; Eddy currents; Electromagnetic measurements; Finite element methods; Impedance measurement; Magnetic field measurement; Materials testing; coil impedance; eddy current sensor; finite element analysis; measured curvature;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Technology, 2008. ICIT 2008. IEEE International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4244-1705-6
Electronic_ISBN
978-1-4244-1706-3
Type
conf
DOI
10.1109/ICIT.2008.4608447
Filename
4608447
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