• DocumentCode
    2706684
  • Title

    Ex vivo performance of printed thick film glucose sensors without immobilized glucose oxidase

  • Author

    Voskerician, Gabriela ; Lynn, Aaron ; Shao, Meijun

  • Author_Institution
    Dept. Biomed. Eng., Case Western Reserve Univ., Cleveland, OH, USA
  • Volume
    2
  • fYear
    2003
  • fDate
    22-24 Oct. 2003
  • Firstpage
    1338
  • Abstract
    The present study investigated the temporal modulation in performance of printed thick film electrochemical sensors without immobilized glucose oxidase by comparing the ex vivo performance of such devices with that of in vitro phosphate buffer saline (PBS) maintained sensors, at similar time points. In addition, a preliminary study was conducted to investigate the dependency of the sensor functionality on the method of sterilization. The oxidation and reduction current involving a ferrous-ferric coupling reaction was used to assess the performance of the electrode elements under in vitro and ex vivo conditions. Imaging analysis was employed to investigate the cellular morphology on the surface of the explanted devices. It was concluded that while the devices were affected by the presence of the surrounding biological environment (cellular adhesion, fibrous capsule formation), the ex vivo performance of the printed thick film sensors was comparable to that of the in vitro prototypes, at similar time points.
  • Keywords
    biosensors; electrochemical sensors; organic compounds; cellular adhesion; cellular morphology; ferrous-ferric coupling reaction; fibrous capsule formation; immobilized glucose oxidase; in vitro phosphate buffer saline maintained sensors; oxidation; printed thick film glucose sensors; reduction current; sterilization; surrounding biological environment; temporal modulation; Adhesives; Electrodes; Image analysis; In vitro; Oxidation; Prototypes; Sugar; Surface morphology; Thick film sensors; Thick films;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2003. Proceedings of IEEE
  • Print_ISBN
    0-7803-8133-5
  • Type

    conf

  • DOI
    10.1109/ICSENS.2003.1279165
  • Filename
    1279165