• DocumentCode
    2707228
  • Title

    High Speed I/O Test Cable Assembly Interfaces for Next Generation Multi-Gigabit Serial Protocols

  • Author

    Vana, Jim ; Barr, Alexander ; Scherer, Richard ; Joshi, Abhay

  • Author_Institution
    Electron. Solutions Div., 3M Co., Austin, TX, USA
  • fYear
    2009
  • fDate
    1-6 Nov. 2009
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    This poster describes high speed I/O test cable interfaces for next generation multi-gigabit serial protocols such as PCI-Express incorporating 3M¿ shielded controlled impedance (SCI) connector systems, spring probe board interfaces and low loss twinaxial cable assemblies with performance capabilities up to 12 Gbps.
  • Keywords
    automatic test equipment; peripheral interfaces; I/O test cable assembly interfaces; automatic test equipment; next generation multi-gigabit serial protocols; shielded controlled impedance; spring probe board interfaces; twinaxial cable assemblies; Assembly systems; Cable shielding; Connectors; Control systems; Impedance; Performance loss; Probes; Protocols; Springs; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2009. ITC 2009. International
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-4868-5
  • Electronic_ISBN
    978-1-4244-4867-8
  • Type

    conf

  • DOI
    10.1109/TEST.2009.5355810
  • Filename
    5355810
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2707228