Package-level Implementation of Multiband Electromagnetic Band-Gap Structures

Author

Kamgaing, Telesphor ; He, Jiangqi ; Hsu, Rockwell

Author_Institution

Assembly Technol. Dev., Intel Corp., Chandler, AZ

fYear

2006

fDate

11-16 June 2006

Firstpage

598

Lastpage

601

Abstract

The design and implementation of package-level electromagnetic band-gap structures is demonstrated. By using spiral-based electromagnetic band-gap structures (EBG), the relative periodicity for achieving band-gap at extremely low frequency is substantially minimized in comparison to traditional EBG´s. Using both full wave electromagnetic simulation and experimental characterization it is demonstrated that this type of structure can exhibit multiple band-gaps, which are individually tunable through variation of the inductance per unit area and its periodicity. Sample structures with dimensions compatible to today´s packaging technology are fabricated and show stop-band behavior in frequency band of interest for commercial wireless communication systems

Keywords

electronics packaging; parallel plate waveguides; photonic band gap; RF-analog mixed signal; commercial wireless communication systems; extremely low frequency; full wave electromagnetic simulation; multiband electromagnetic band-gap structures; multiple band-gaps; package-level implementation; parallel-plate waveguides; relative periodicity; signal isolation; spiral-based EBG; Electromagnetic waveguides; Frequency; Inductance; Metamaterials; Optical waveguides; Packaging; Periodic structures; Photonic band gap; Spirals; Thin film inductors; Electromagnetic band-gap structures; RF/analog mixed signal; parallel-plate waveguides; signal isolation;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2006. IEEE MTT-S International

Conference_Location

San Francisco, CA

ISSN

0149-645X

Print_ISBN

0-7803-9541-7

Electronic_ISBN

0149-645X

Type

conf

DOI

10.1109/MWSYM.2006.249665

Filename

4014971