DocumentCode
2712185
Title
Modeling filler volume fraction and film thickness effects on conductive adhesive resistivity
Author
Sancaktar, Erol ; Bai, Lan
fYear
2004
fDate
12-15 Sept. 2004
Firstpage
38
Lastpage
49
Keywords
Conductive adhesives; Conductive films; Conductivity; Dielectrics and electrical insulation; Electrons; Metal-insulator structures; Polymers; Powders; Shape; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN
0-7803-8744-9
Type
conf
DOI
10.1109/POLYTR.2004.1402737
Filename
1402737
Link To Document