• DocumentCode
    2713016
  • Title

    Modeling of sound-structure interaction in a rectangular enclosure using finite element method

  • Author

    Mohamady, Samira ; Montazeri, Allahyar ; Ahmad, R. K Raja

  • Author_Institution
    Fac. of Electr. & Electron. Eng., Univ. Putra Malaysia, Serdang, Malaysia
  • Volume
    2
  • fYear
    2009
  • fDate
    4-6 Oct. 2009
  • Firstpage
    748
  • Lastpage
    753
  • Abstract
    In this paper the effect of periodic noise traveling into a rectangular enclosure is simulated using finite element technique using COMSOL Multiphysics software. The acoustic wave which is generated by a point source outside an enclosure propagates through the enclosure wall and excites the flexible panel which is mounted on the enclosure. The behavior of transmission of sound into the cavity is investigated by computing the modal characteristics of the cavity. Base on the model proposed, simulation part is conducted to examine the natural frequency response of system as well as to compute the distortion effect of the structure response and the acoustic pressure observed within the enclosure. The simulation results were compared with previous experimental and analytical works for validation and a good match between them were obtained.
  • Keywords
    acoustic noise; acoustic wave propagation; acoustic wave transmission; finite element analysis; structural acoustics; COMSOL Multiphysics software; acoustic pressure; acoustic wave; finite element method; flexible panel; modal characteristics; natural frequency response; periodic noise; rectangular enclosure; sound transmission; sound-structure interaction modeling; Acoustic noise; Acoustic waves; Acoustical engineering; Analytical models; Boundary conditions; Computational modeling; Finite element methods; Industrial electronics; Noise level; Vibrations; Acoustic-Structure coupling; COMSOL; Noise and Vibration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics & Applications, 2009. ISIEA 2009. IEEE Symposium on
  • Conference_Location
    Kuala Lumpur
  • Print_ISBN
    978-1-4244-4681-0
  • Electronic_ISBN
    978-1-4244-4683-4
  • Type

    conf

  • DOI
    10.1109/ISIEA.2009.5356354
  • Filename
    5356354