• DocumentCode
    2718195
  • Title

    A Bayesian based EDA tool for accurate VLSI reliability evaluations

  • Author

    Ibrahim, Walid ; Beg, Azam ; Amer, Hoda

  • Author_Institution
    Coll. of Inf. Technol., UAE Univ., Al Ain
  • fYear
    2008
  • fDate
    16-18 Dec. 2008
  • Firstpage
    101
  • Lastpage
    105
  • Abstract
    As the sizes of (nano) device are aggressively scaled deep towards the nanometer regime, the design and manufacturing of future nano-circuits will become extremely complex and inevitably introduce more defects and their functioning will be adversely affected by transient faults. Therefore, accurately calculating the reliability of future designs will become a very important factor for nano-circuit designers as they investigate several design alternatives to optimize the trade-offs between the conflicting metrics of area-power-energy-delay versus reliability. This paper introduces a novel EDA tool for accurate calculation of future nano-circuits reliabilities. Our aim is to provide both educational and research institutions (as well as the semiconductor industry at a later stage) with an accurate and easy to use tool for comparing the reliability of different design alternatives, and for selecting the design that best fits a set of given (design) constraints.
  • Keywords
    Bayes methods; VLSI; electronic design automation; integrated circuit reliability; nanotechnology; Bayesian based EDA tool; VLSI reliability evaluations; area-power-energy-delay; electronic design automation; semiconductor industry; transient faults; Bayesian methods; DNA; Design optimization; Electronic design automation and methodology; Electronics industry; Manufacturing; Nanoscale devices; Semiconductor device reliability; Very large scale integration; Yield estimation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Innovations in Information Technology, 2008. IIT 2008. International Conference on
  • Conference_Location
    Al Ain
  • Print_ISBN
    978-1-4244-3396-4
  • Electronic_ISBN
    978-1-4244-3397-1
  • Type

    conf

  • DOI
    10.1109/INNOVATIONS.2008.4781735
  • Filename
    4781735