• DocumentCode
    2721189
  • Title

    High power laminate MEMS RF switch

  • Author

    Kim, Sung Jun ; Zhang, Yang ; Wang, Minfeng ; Bachman, Mark ; Li, G.-P.

  • Author_Institution
    Univ. of California, Irvine, Irvine, CA, USA
  • fYear
    2012
  • fDate
    May 29 2012-June 1 2012
  • Firstpage
    115
  • Lastpage
    120
  • Abstract
    An innovative high power radio frequency switch designed and manufactured using LMEMS (Laminate Micro Electro-Mechanical System) is reported. The LMEMS technology is developed by adopting current multi-layered printed circuit board (PCB) manufacturing technology, and integrating it with laminated layers including moving parts and specialty materials. RF switch performance is achieved by optimizing device design and layout for improving offstate isolation and reducing on-state insertion loss. High power performance is realized by use of laminate PCB technology and special contact metallurgy suitable for reducing both hot switching and high current welting. A RF LMEMS switch design is demonstrated to function up to 10 GHz and 50 W power handling capability.
  • Keywords
    laminates; microswitches; microwave switches; printed circuit design; printed circuit manufacture; frequency 10 GHz; high current welting; high power laminate MEMS RF switch; high power radio frequency switch; hot switching; laminate microelectromechanical system; laminated layer; multilayered printed circuit board manufacturing technology; offstate isolation; power 50 W; power handling; Coils; Microstrip; Microswitches; Radio frequency; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4673-1966-9
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2012.6248815
  • Filename
    6248815