• DocumentCode
    2722808
  • Title

    Effect of H2 Addition during Cu Thin Film Sputtering

  • Author

    Ooka, Masahiro ; Yokoyama, Shin

  • Author_Institution
    Res. Center for Nanodevices & Syst., Hiroshima Univ.
  • fYear
    2006
  • fDate
    24-26 April 2006
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    In this paper, we study the effect of H2 adding to Cu sputtering and also investigate the influence on the subsequent Cu electroplating
  • Keywords
    copper alloys; electroplating; hydrogen compounds; metallic thin films; sputter etching; Cu; H2; copper electroplating; copper thin film sputtering; hydrogen gas addition; Argon; Atomic measurements; Conductivity; Hydrogen; Oxidation; Rough surfaces; Sputtering; Surface morphology; Surface roughness; X-ray scattering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems, and Applications, 2006 International Symposium on
  • Conference_Location
    Hsinchu
  • ISSN
    1524-766X
  • Print_ISBN
    1-4244-0181-4
  • Electronic_ISBN
    1524-766X
  • Type

    conf

  • DOI
    10.1109/VTSA.2006.251096
  • Filename
    4016632
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2722808