• DocumentCode
    2724874
  • Title

    A Wafer test method of inductive-coupling link

  • Author

    Kasuga, Kazutaka ; Saito, Mitsuko ; Takeya, Tsutomu ; Miura, Noriyuki ; Ishikuro, Hiroki ; Kuroda, Tadahiro

  • Author_Institution
    Dept. of Electron. & Electr. Eng., Keio Univ., Yokohama, Japan
  • fYear
    2009
  • fDate
    16-18 Nov. 2009
  • Firstpage
    301
  • Lastpage
    304
  • Abstract
    This paper provides the method for wafer test of an inductive-coupling link. The inductive-coupling link can be tested whether it operates correctly before stacking chips. We provided the method that verify the operation of an inductive-coupling link from the relation between coupling coefficient of inductors and power that transmitter consumes.
  • Keywords
    electromagnetic induction; integrated circuit testing; interconnections; coupling coefficient; inductive coupling link; inductors; transmitter; wafer test method; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2009. A-SSCC 2009. IEEE Asian
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4433-5
  • Electronic_ISBN
    978-1-4244-4434-2
  • Type

    conf

  • DOI
    10.1109/ASSCC.2009.5357251
  • Filename
    5357251
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2724874