• DocumentCode
    2725212
  • Title

    High-density capacitors with conformal high-k dielectrics on etched-metal foils

  • Author

    Chakraborti, Parthasarathi ; Sharma, Himani ; Raj, P. Markondeya ; Tummala, Rao

  • Author_Institution
    Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2012
  • fDate
    May 29 2012-June 1 2012
  • Firstpage
    1640
  • Lastpage
    1643
  • Abstract
    This paper describes the fabrication and characterization of high-density capacitors using etched-metal foils as high-surface area electrodes. High permittivity films were conformally-formed over the metal foils using an anodization reaction. The approach was demonstrated with two material systems, viz., etched aluminum foils and porous titanium foils. Both the metal anodizations were carried out with aqueous solution of citric acid as electrolytes. The electrical properties of the etched-foil capacitor were measured using a sulfuric acid solution as the top contact. The high surface area electrodes yielded very high capacitance densities of 35-40 μF/cm2.
  • Keywords
    aluminium; capacitors; etching; semiconductor device manufacture; titanium; Al; Ti; anodization reaction; aqueous solution; citric acid; conformal high-k dielectrics; electrolytes; etched-metal foils; high permittivity films; high-density capacitors; high-surface area electrodes; sulfuric acid solution; Aluminum; Capacitance; Capacitors; Electrodes; Surface treatment; Titanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4673-1966-9
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2012.6249057
  • Filename
    6249057