An electrical design and fabrication of a 12-channel optical transceiver with SiP packaging technology

Author

Gao, Wei ; Li, Zhihua ; Song, Jian ; Zhang, Xu ; Chen, Feng ; Liu, Fengman ; Zhou, Yunyan ; Li, Jun ; Xiang, Haifei ; Zhou, Jing ; Liu, Shuhua ; Wang, Yu ; Wang, Qidong ; Li, Baoxia ; Shi, Zhan ; Cao, Liqiang ; Wan, Lixi

Author_Institution

Inst. of Microelectron., Chinese Acad. of Sci., Beijing, China

fYear

2010

fDate

1-4 June 2010

Firstpage

2006

Lastpage

2011

Abstract

This paper presents an electrical design of a 6.25Gbps×12-channel parallel optical transceiver with SiP packaging technology. Considering such high speed, a low impedance and low noise power distribution network (PDN) is designed to suppress simultaneous switching noise (SSN) and a novel embedded capacitor filter is used to replace the conventional power supply filter. To minimize the impedance discontinuity of electrical channels, a signal integrity (SI) design flow based on Electromagnetic Analysis Method and Circuit Analysis Method is proposed. Following this design flow, the high speed link performs on a large bandwidth. With the electrical design, the optical transceiver is fabricated and tested.

Keywords

Circuit noise; High speed optical techniques; Impedance; Optical design; Optical device fabrication; Optical filters; Optical noise; Packaging; Power systems; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th

Conference_Location

Las Vegas, NV, USA

ISSN

0569-5503

Print_ISBN

978-1-4244-6410-4

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2010.5490671

Filename

5490671