Tiny Pitts are the Yield Major Killer Caused by Metal Contamination in Wet Bench Cleaning

Author

Chen, Sheng-Hsiung ; Chen, Shen-Li ; Chung, Long-Yeu ; Yeh, Wen-Kuan

Author_Institution

Dept. of Electr. Eng., Tung Fang Inst. of Technol., Kaohsiung

fYear

2006

fDate

3-7 July 2006

Firstpage

129

Lastpage

132

Abstract

In this paper, we analyzed the contamination of heavy metals on process wafers before gate oxide deposition. A lot of mushrooms-like defects were easy found in wafer edge. And at that time, a lot of pits also can be found in active region of device, as the silicon substrate had been with heavy metallic contamination. TEM and EDS analysis were used to examine the mushrooms type defects and pits defects. A reasonable mechanism was proposed to check the problem stage of manufacturing process

Keywords

semiconductor device manufacture; surface cleaning; surface contamination; transmission electron microscopy; EDS; TEM; gate oxide deposition; heavy metals; metal contamination; mushroom like defects; process wafers; tiny pits; wet bench cleaning; Chemical processes; Cleaning; Gases; Inorganic materials; Iron; Manufacturing processes; Semiconductor device manufacture; Silicon; Surface contamination; Ultra large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits, 2006. 13th International Symposium on the

Conference_Location

Singapore

Print_ISBN

1-4244-0205-0

Electronic_ISBN

1-4244-0206-9

Type

conf

DOI

10.1109/IPFA.2006.251013

Filename

4017038