DocumentCode
2729723
Title
Prediction of interface conductivity of cement slurry during early hydration considering the effect of curing temperature and pressure
Author
Ridha, S. ; Irawan, S. ; Ariwahjoedi, B.
Author_Institution
Dept. of Geosci. & Pet. Eng., Univ. Teknol. PETRONAS, Seri Iskandar, Malaysia
fYear
2011
fDate
25-28 Sept. 2011
Firstpage
114
Lastpage
119
Abstract
Electrical conductivity measurements have been widely used in characterizing the cementitious materials. In mature stages, the influence of interface conductivity to the overall conduction was relatively small. However, its contribution during early hydration is still questionable. This paper calculated the interface conductivity during the first 24 hrs of hydration at elevated temperature and pressure up to 65°C and 3000 psi. The effect of elevated temperature to conductivity measurement is successfully corrected. Johnson equation is employed to predict the interface conductivity of pore-solid particles. The microstructural parameters that are used in the equation are estimated from the proposed particle expansion model. These calculation outcomes have a good agreement compared to the MIP measurements. The results showed that the interface conductivity grew slightly with the progress of drying. Its contribution to the bulk conductivity is relatively very small of about factor 6 in orders of magnitude. Hence, the influence of interface conductivity to the overall conduction might be disregarded during cement´s early hydration.
Keywords
cements (building materials); curing; drying; electrical conductivity measurement; pressure; slurries; solvation; temperature; Johnson equation; cement early hydration; cement slurry; cementitious materials; conductivity measurement; curing pressure; curing temperature; drying; interface electrical conductivity; particle expansion model; Conductivity; Curing; Equations; Mathematical model; Slurries; Solids; Temperature measurement; elevated temperature; interface conductivity; particle expansion model; well cement;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics and Applications (ISIEA), 2011 IEEE Symposium on
Conference_Location
Langkawi
Print_ISBN
978-1-4577-1418-4
Type
conf
DOI
10.1109/ISIEA.2011.6108679
Filename
6108679
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