• DocumentCode
    2730249
  • Title

    Modeling of the Leakage Current in Ultrathin La2O3 Films Using a Generalized Power Law Equation

  • Author

    Miranda, E. ; Iwai, H.

  • Author_Institution
    Departament d´´Enginyeria Electronica, Univ. Autonoma de Barcelona, Bellaterra
  • fYear
    2006
  • fDate
    3-7 July 2006
  • Firstpage
    306
  • Lastpage
    310
  • Abstract
    The leakage current in electrically stressed MOS structures with ultrathin lanthanum oxide (La2O3) films was investigated. The samples were obtained by the electron-beam evaporation technique and annealed in-situ in ultra-high vacuum conditions. We show that the application of successive voltage ramps leads to a set of current-voltage (I-V) characteristics that can be simulated using a power-law model with series and parallel resistances. This particular voltage dependence, in combination with the stepwise increase exhibited by the current-time (I-t) characteristic during a constant voltage stress, suggests that the leakage current through the oxide layer might be ascribed to multiple dielectric breakdown conduction
  • Keywords
    MIS structures; annealing; dielectric thin films; electric breakdown; equivalent circuits; lanthanum compounds; leakage currents; vacuum deposition; La2O3; MOS structures; constant voltage stress; current-time characteristic; current-voltage characteristics; dielectric breakdown conduction; electron-beam evaporation; generalized power law equation; in-situ annealing; leakage current modeling; power-law model; successive voltage ramps; ultra-high vacuum conditions; ultrathin films; Annealing; Breakdown voltage; Capacitors; Collaboration; Dielectric breakdown; Diodes; Equations; Leakage current; Stress; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2006. 13th International Symposium on the
  • Conference_Location
    Singapore
  • Print_ISBN
    1-4244-0205-0
  • Electronic_ISBN
    1-4244-0206-9
  • Type

    conf

  • DOI
    10.1109/IPFA.2006.251051
  • Filename
    4017076