Glass-ceramic on metal substrates for high performance packaging

Author

Logan, E.A. ; Holland, D. ; Thorp, J.S. ; Partridge, G.

Author_Institution

Dept. of Phys., Warwick Univ., Coventry, UK

fYear

1988

fDate

13-15 Jun 1988

Firstpage

14

Lastpage

17

Abstract

Several glass-ceramic on metal coatings have been evaluated to address the need for a high thermal conductivity substrate. The substrate materials have been chosen and processed to given them thermal expansion coefficients which are similar to that of silicon, thus avoiding the creation of stresses in the device during thermal cycling. The thermal expansion matching of the glass-ceramic to the metal is achieved by the controlled crystallization of phases of known thermal expansion coefficients. This has been confirmed by X-ray and microstructural examination of a lithium aluminosilicate type glass-ceramic on copper/Invar/copper and of a magnesium aluminosilicate type glass-ceramic on molybdenum and on tungsten give values for the relative permittivity of the glass-ceramic layer of 5.9 and 5.8 respectively and values for tan delta between 10^-3 and 10^-2

Keywords

packaging; substrates; thermal expansion; Cu; Cu-Invar-Cu; Cu-NiMn-Cu; Li₂O-Al₂O₃-SiO₂; MgO-Al₂O₃-SiO₂; Mo; Ni-Mn; W; controlled crystallization; glass ceramic substrate; high thermal conductivity substrate; relative permittivity; thermal expansion coefficients; thermal expansion matching; Coatings; Conducting materials; Copper; Crystalline materials; Crystallization; Packaging; Silicon; Thermal conductivity; Thermal expansion; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1988, Fourth IEEE/CHMT European International

Conference_Location

Neuilly sur Seine

Type

conf

DOI

10.1109/EEMTS.1988.75943

Filename

75943