Morphology and structure in dielectric anodic alumina

Author

Sukonnik, I. ; Forster, J.

Author_Institution

Texas Instrum. Inc., Dallas, TX, USA

fYear

1988

fDate

27-30 Jun 1988

Firstpage

109

Lastpage

112

Abstract

The morphology and microstructure affecting the dielectric and other properties of anodic aluminum oxide were studied. It was found that the structure of the anodic film closely resembles materials produced by cathodic deposition or the solidification of liquid metals. The anodic film was characterized by a banded, compressively stressed, and columned microstructure which contains randomly-oriented voids (porosity). It is proposed that film formation is based on the diffusion of aluminum ions in the oxide. It is demonstrated that the properties and morphology of the film are affected by the composition and the microstructure of the aluminum substrate and the chemistry of the electrolyte

Keywords

alumina; anodised layers; crystal microstructure; crystal morphology; dielectric thin films; electric strength; fracture; permittivity; scanning electron microscope examination of materials; surface structure; Al ion diffusion; SEM image; anodic film; banded film structure; cathodic deposition; compressive fracture; dielectric anodic Al₂O₃; electrolyte chemistry; liquid metals; microstructure; morphology; porosity; randomly-oriented voids; solidification; tensile fracture;

fLanguage

English

Publisher

iet

Conference_Titel

Dielectric Materials, Measurements and Applications, 1988., Fifth International Conference on

Conference_Location

Canterbury

Print_ISBN

0-85296-359-9

Type

conf

Filename

9435