DocumentCode
2733003
Title
Epitaxial ternary and quaternary III-V antimonide substrates
Author
Malik, M.G. ; Cox, Jeffrey A. ; Sulima, Oleg V. ; Datta, Sarbajit ; Tata, Anthony N.
Author_Institution
AstroPower Inc., Newark, DE, USA
fYear
2002
fDate
6-8 Aug. 2002
Firstpage
213
Lastpage
222
Abstract
Modified liquid-phase epitaxy (LPE) techniques can be adapted for the growth of relatively thick (50 to 500 micron) epitaxial layers of ternary and quaternary Ill-V antimonide alloys, including InAsSb, InGaSb, AlGaAsSb, InGaAsSb, and InAsSbP. These structures can function as ´virtual´ substrates with adjustable lattice constants for epitaxy of various optoelectronic devices such as mid-infrared photodiodes. A variety of substrate structures can be realized either by effecting gradual, continuous compositional grading of thick epilayers, or by growing multilayers with abrupt but incremental compositional changes between adjacent layers. Both approaches can be combined with selective removal of the seeding substrate and wafer bonding techniques. Low-defect alloy substrates with increased functionality, and with lattice constants and bandgaps significantly different than available with binary compound wafers (e.g., InAs or GaSb), appear feasible.
Keywords
III-V semiconductors; energy gap; lattice constants; liquid phase epitaxial growth; multilayers; optoelectronic devices; semiconductor epitaxial layers; semiconductor growth; substrates; wafer bonding; 50 to 500 micron; AlGaAsSb; InAsSb; InAsSbP; InGaAsSb; InGaSb; bandgaps; continuous compositional grading; epitaxial layers; lattice constants; liquid-phase epitaxy techniques; low-defect alloy substrates; mid-infrared photodiodes; modified LPE techniques; multilayers; optoelectronic devices; quaternary III-V antimonide alloys; substrate structures; ternary III-V antimonide alloys; wafer bonding techniques; Epitaxial growth; Epitaxial layers; III-V semiconductor materials; Lattices; Nonhomogeneous media; Optoelectronic devices; Photodiodes; Photonic band gap; Substrates; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
High Performance Devices, 2002. Proceedings. IEEE Lester Eastman Conference on
Print_ISBN
0-7803-7478-9
Type
conf
DOI
10.1109/LECHPD.2002.1146753
Filename
1146753
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