• DocumentCode
    2733157
  • Title

    Setup for Measuring the Derating of SMD Components under ESD Stress

  • Author

    Streibl, Franz ; Tenbohlen, Stefan ; Hartmann, Jörg ; Dudenhoeffer, Eric

  • Author_Institution
    Inst. of Power Transm. & High Voltage Technol., Univ. Stuttgart, Stuttgart
  • fYear
    2009
  • fDate
    12-16 Jan. 2009
  • Firstpage
    145
  • Lastpage
    148
  • Abstract
    This paper presents a mechanical setup for measuring the derating of surface mounted devices. The derating is caused here by single or multiple electrostatic discharges from common simulator equipment. In the field, electrostatic discharges potentially damage or destroy the input circuitry of electronic control units. Often only secondary effects such as system malfunctions or reduced electromagnetic compatibility indicate a derating of the input circuitry from previous electrostatic discharges. Within the setup presented here, the device under test is placed into a two-port coaxially interfaced container fit for all common electrical characterisation methods, such as impedance and network analysis. The design features standard Pellegrini flange dimensions and is therefore suitable for manual or semi-automatic test implementations within already existing electrostatic test setups.
  • Keywords
    electromagnetic compatibility; electrostatic discharge; radiation hardening (electronics); surface mount technology; ESD stress; SMD components derating; electromagnetic compatibility; electrostatic discharges; simulator equipment; standard Pellegrini flange dimension; surface mounted device; two-port coaxially interfaced container; Circuit simulation; Circuit testing; Coaxial components; Electromagnetic compatibility; Electromagnetic measurements; Electrostatic discharge; Electrostatic measurements; Mechanical variables measurement; Stress measurement; Surface discharges;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2009 20th International Zurich Symposium on
  • Conference_Location
    Zurich
  • Print_ISBN
    978-3-9523286-4-4
  • Type

    conf

  • DOI
    10.1109/EMCZUR.2009.4783411
  • Filename
    4783411